Press Release

TAIPEI, Dec. 13, 2021 /PRNewswire/ -- Server manufacturer Inventec (TPE: 2356) hosts its inaugural virtual exhibition to unveil its latest server solutions with AMD EPYCTM 7003 series processors and 3rd Gen Intel® Xeon Scalable processors. 2021 Inventec EBG Virtual Exhibition From 13 December, exhibition attendees will be able to browse three online showrooms highlighting Inventec's AMD platform servers, Intel® platform servers, and new 5G smart factory applications. For more information, click here. Breakthrough Performance and Modern Security Backed by AMD EPYC™ 7003 series processors During the exhibition, Inventec will demonstrate two server solutions based on AMD EPYC™ 7003 series processors: the Steelix 2U24Bays warm storage server and the Horsea 2U2P server. Steelix is a high-density storage server that delivers efficient computing performance with a revolutionary single socket solution. The high-density 2U form factor supports 24x 3.5'' HDDs and 4x 2.5'' SSD hot-plug drives for greater flexibility and scalability while Steelix optimizes serviceability with a hot-swappable fan module. Also on display is Inventec's Horsea server, the alternative high-performance 2U server system based on dual socket 7nm AMD EPYC™ 7003 series processors. Highly adaptable and serviceable, Horsea is a top virtualization solution with optimal TCO, enhanced security, and greater scalability unleashed by the latest PCIe Gen4 and OCP 3.0 technologies. Industry-leading Workload-optimized Platforms Equipped with 3rd Gen Intel® Xeon Scalable Processors In its Intel® showroom, Inventec will showcase the Inventec Seadra, a high-performance, high efficiency 2U2P server system that utilizes the latest generation of Intel® Xeon Scalable processors. Inventec Seadra has the ability to accommodate up to 6x PCIe Gen4 x16 slots and 1x OCP 3.0 slot. Seadra supports TDP of up to 270W and offers high bandwidth network communications capabilities, while reducing TCO — suitable for handling diverse scenarios, including virtualization, hyper-converged storage, cloud computing, and high-end enterprise servers. Furthermore, attendees can discover the Inventec Solrock, a 2U4N server with 3rd Gen Intel® Xeon Scalable processors, and the E200G4, a high-performance edge AIoT device backed by an 11th Gen Intel® Core TigerLake-UP3 CPU. The E200G4 supports outstanding computing capability for AI and Edge IoT systems and features Intel® Iris Xe graphics that can decode over 40 video streams at 1080p resolution and 30fps. Behind the Scenes of Inventec's Groundbreaking 5G Smart Factory In the third showroom, Inventec will demonstrate the vast applications of its cutting-edge 5G smart factory. Featuring 5G ultra-reliable low latency communications (uRLLC), enhanced mobile broadband (eMBB) and support for massive machine-type communications (mMTC), Inventec's 5G Smart Factory is continuously implementing intelligent manufacturing systems, enables AOI detection, AR/XR smart assembly, AGV auto loading operation, robotic and AI process collaborations, predictive maintenance and remote management, among others. Inventec's virtual exhibition is the first of its kind organized by Inventec Enterprise Business Group (EBG) and will run until 13 December 2022. To participate, visit https://ebg.inventecvirtual.com/   About Inventec Data Center Solutions (Inventec EBG) Established in 1998, Inventec Data Center Solutions (Inventec EBG) has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over the decades, Inventec EBG has been a key server system supplier of the global branding clients. For more information, visit: https://ebg.inventec.com/en. Follow "Inventec Data Center Solutions" on LinkedIn and Wechat to receive the latest news and announcements. Inventec logos are trademarks or registered trademarks of Inventec Corporation. AMD, the AMD Arrow logo, EPYC and combinations thereof are trademarks of Advanced Micro Devices, Inc. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. All trademarks and logos are the properties of their respective holders.

TAIPEI, Dec. 01, 2021/ PRNewswire/ -- Server manufacturer Inventec (TPE: 2356) has introduced its latest high density storage server Steelix. This new industry-leading server provides efficient computing performance with a single socket solution that supports the new 3rd Gen AMD EPYC™ processor.     “Steelix is an ideal hybrid system for warm storage and is applicable to further storage applications. By optimizing the ratio of SSDs and HDDs, it can highly accelerate IOPS and throughput performance while offering excellent storage capacity. Steelix can provide a higher virtualized workload and adapt quickly to changing business computing needs,” said George Lin, General Manager of Business Unit VI, Inventec Enterprise Business Group (Inventec EBG).   Highlight of Steelix   - Enhanced performance with single socket solution - Advanced Security - High-density 2U form factor - Supports 24x LFF HDD bay - Flexible and scalable I/O options - Optimized serviceability   Enhanced Performance and Security   With TDP of up to 280W, Steelix provides a high-level performance with up to 64 cores, 128 lanes of PCIe Gen4 connectivity, and up to 4TB of memory across 16 DIMM slots. The server also possesses up to 32MB of L3 cache per 8 cores, supporting heavy workloads.   At the same time, Steelix helps minimize potential attack surfaces and protect software and data through the AMD Infinity Guard features, including Secure Memory Encryption (SME) which helps secure the boot process and encrypts the entire main memory, and Secure Encrypted Virtualization (SEV) which helps secure virtualized and container environments.   High-Density with Greater Scalability   Steelix offers a range of hot-pluggable hybrid flash options within the 2U form factor. The server’s 24 LFF HDD bays and four rear side SSD bays provides multiple storage options for increased flexibility and scalability. The high-density storage unit also includes NVMe support in the rear for a caching layer, 1x M.2 via interposer connection, and a variety of storage mezzanine cards, while supporting up to 4TB of DDR4 memory.   Hosting 4x PCIe slots with riser cards and 1 PCIe x16 lanes for OCP 3.0, Steelix is a hybrid system for warm storage and applicable for various storage applications.   Increased Flexibility and Optimized Serviceability   Understanding that each user has different needs, Steelix is created to be adaptable to various scenarios. For example, Steelix offers an OCP NIC mezzanine option, ranging from 10G Ethernet to 100G to allow high-speed performance and I/O flexibility.   At the same time, the storage server possesses a hot-swappable fan module with easy serviceability in a simple 2U enclosure which includes:   - PSU with 1+1 Redundancy - 24x 3.5” HDD in the front HDD Tray - 4x Rear 2.5” SSD - 5x 6056 Hot-swap fan   About Inventec Data Center Solutions (Inventec EBG) Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.   For more information, please visit: https://ebg.inventec.com/en Follow "Inventec Data Center Solutions" on LinkedIn and Wechat to receive their latest news and announcements.   Inventec logos are trademarks or registered trademarks of Inventec Corporation. AMD, the AMD Arrow logo, EPYC and combinations thereof are trademarks of Advanced Micro Devices, Inc.    

微軟邀英業達卓董 卓桐華 解讀雲端轉型與5G智慧工廠馭風而行 https://news.microsoft.com/zh-tw/features/flora-podcast-ep4/ 英業達卓董－卓桐華分享在全球供應鏈的改變下，企業雲端轉型、防禦資安問題。 ✅ 結合硬體、軟體，開創新轉型之路 ✅企業上雲帶來企業文化與領導文化的改變 ✅5G 轉型簡化企業流程，成為數位轉型要角          

TAIPEI, July 30, 2021  /PRNewswire/ -- Server manufacturer Inventec (TPE: 2356) has unveiled its latest high-efficiency Artificial Intelligence of Things (IoT) Edge box system, the E200G4.                         Outstanding Computing Capability for AI and Edge Applications Inventec introduces AIoT E200G4, the Microsoft Azure certified device.   By 2025, 55.6% of all data will come from IoT devices, including retail devices, industrial equipment, digital signage, medical implants. 11th Gen Intel® Core processors are enhanced for IoT, with this future in mind. A high-performance edge AIoT device, the Inventec E200G4 is backed by an 11th Gen Intel® Core TigerLake-UP3 CPU that supports high performance and reliability for IoT systems and Intel Iris Xe graphics that can decode over 40 video streams at 1080p resolution and 30fps. Excellent Flexibility with Multiple Wireless/AI Modules Inventec E200G4 provides multiple internal M.2 expansion slots and wireless modules, supporting 4GLTE or 5GNR (sub-6G) and WiFi-6 modules for IoT applications or SSD NVMe modules for general storage. The system is equipped with two slots for AI accelerators of up to 70 TOPS. In addition, the E200G4's high-bandwidth network communication capabilities can cater to the demands of different application procedures. 5G Fixed Wireless Access E200G4 supports Fixed Wireless Access (FWA) technology that delivers 5G/LTE broadband services to residential subscribers and enterprise customers. E200G4 is Microsoft Azure certified device, which allows for quick and efficient deployment as an edge device for Microsoft cloud services. A New Software-Driven platform Through a collaboration with Canonical, E200G4 adopts the Ubuntu Linux operation system (OS) with access to the Canonical supported Inventec Store, an app store providing complete control over store content, review processes and identity. E200G4 can also run Canonical's open source NFV stack, designed for hosting VNFs with optimum performance and security requirements, to become an NFVI (Network Functions Virtualization Infrastructure) platform. Industrial-Level System with Wide Operating Temperature Range Highly modular and ultra-thin (8.66 x 1.66 x 6.77 inch), the fan less E200G4 AIoT Box makes maintenance and servicing a breeze. The E200G4 can operate optimally between -20 and 60 Celsius with a wide operating temperature range and 0.7m/s airflow. Its strong environmental adaptability is bolstered by an Ingress Protection rating of 51 in addition to protection standards of IEC 60068-2-64 for vibrations and IEC 60068-2-27 for shocks during operations. The E200G4's sturdy and industry-level system make it perfect for a wide variety of typical IoT applications, including intelligent video surveillance, extensive data analysis, Industry 4.0, and smart healthcare. This is enhanced by Intel Time Coordinated Computing-enabled processors that deliver optimal compute and time performance for real-time IoT applications. "Our long-established relationship with Intel means Inventec constantly offers users Intel-powered industrial performance AIoT with market-leading TCO (total cost of ownership)," said George Lin, General Manager of Business Unit VI, Inventec Enterprise Business Group (Inventec EBG). "Our latest AIoT, the E200G4, is an ideal uCPE or edge device for integrated AI acceleration while supporting applications that demand high-speed processing, computer vision, and low-latency deterministic computing," Lin added. About Inventec Data Center Solutions (Inventec EBG) Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.   For more information, please visit: https://ebg.inventec.com/en Follow "Inventec Data Center Solutions" on LinkedIn and Wechat to receive their latest news and announcements.    Inventec logos are trademarks or registered trademarks of Inventec Corporation.  Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.  All trademarks and logos are the properties of their respective holders.  

左起為英業達企業電腦事業群總經理蔡枝安、英業達董事長卓桐華、台灣微軟總經理孫基康、台灣微軟物聯網卓越中心副總經理李啓後。     微軟攜手英業達5動5G智慧工廠策略合作 再創智慧製造轉型新動能   整合雙方優勢，以企業專網解決方案樹立代工廠升級新典範   【2021年06月17日，台北訊】疫情加速企業數位轉型步伐，台灣產業紛紛開始採用雲端提升企業靈活、彈性，並以創新技術面對挑戰。為實現智慧製造，台灣微軟與英業達今日宣布簽署合作備忘錄，啟動「Inventec 5G Smart Factory IoT 平台建置計畫」，攜手打造全新 5G 智慧工廠架構，透過微軟旗下以虛擬化運作的雲原生（cloud native 5G private core）網路解決方案 Affirmed Networks，開啟雙方戰略合作，以企業專網解決方案樹立代工廠升級新典範。   英業達成立至今逾 40 年，以筆電、伺服器製造奠定基礎，跨界投入雲端運算、無線通訊及 IoT技術，開啟其製造轉型旅程，非常重視企業創新價值與策略布局，因此 2019 年在其他企業仍受限於傳統 IT 架構時，英業達便成立 5G 研發中心，並於 2020 年開始應用 5G 技術至產線中，藉由實際展現導入 5G 帶來的數據提升、運作成效等實績，化被動服務為主動，搶先掌握客戶需求。英業達董事長卓桐華表示：「此次選擇與微軟旗下的 Affirmed Networks 合作，不僅是看重其在核心網路解決方案上豐富的經驗，更在功能完整性、資安以及與 5G 的連結性上都符合我們的需求。希望雙方合作不只可使英業達改善製程的學習曲線及效率，同時也能樹立產業標竿，進一步協助其他製造大廠建造智慧工廠，開創全新的 5G 智能時代。」   台灣微軟總經理孫基康表示：「全球疫情加速各產業的數位轉型步伐，5G 則是串起『邊緣』和『雲端』的關鍵，然而這項技術能否被靈活應用，須仰賴成熟的通訊生態系統。微軟雲端相關解決方案，將能以更安全且高效的方式為5G生態系統帶來更多創新的服務與體驗。Affirmed Networks 基於雲原生的解決方案，能賦予企業和社會全新機會與視野。英業達的智慧工廠，結合了微軟的雲端平台與英業達的基礎架構完整解決方案，配合 5G 帶來的優勢，打造製造業轉型的解決方案的全新典範。」     軟硬整合雙強者聯手 以創新 5G 與雲端技術構築全新智造工廠願景   身為微軟 Azure IoT 夥伴，英業達透過微軟 5G 專網並採用 Azure 雲端運算，整合軟體虛擬化技術以及開放式硬體概念，建構完全虛擬化、基於 Open-RAN 的 5G 獨立組網企業網。此次英業達與微軟的 Inventec Smart Factory IoT+5G 平台建置計畫合作內容包含：   1. 英業達運用微軟 5G 專網解決方案及 Metaswitch 產品等雲核網技術，搭配微軟 Azure Stack Edge、微軟 Azure 雲端服務與物聯網技術，開發且建置 Industrial Automation Manufacture（工業製造自動化）及 Energy Management Twin（能源管理分身）等 Digital Twins（數位分身）平台，強化並加速英業達產品研發與創新，進一步開發且整合微軟雲端服務。 2. Microsoft Enterprise Skills Initiative 訓練課程，協助英業達強化微軟雲端服務相關技能，並取得相關微軟認證，提升英業達人才專長，加速執行「Inventec Smart Factory IoT + 5G 平台建置計畫」。   英業達雲網方案事業部經理江智偉表示：「英業達智慧工廠最重要的轉型，即是將核心網路轉換為靈活的雲端版本，因此更容易在雲端平台上運作各種應用，開發介面的界接也相對容易與方便，而我們借重 Affirmed Networks 優秀的核心網路解決方案，以及支援 5G 網路需求，發展出有別以往的商業模式。」   台灣微軟物聯網卓越中心副總經理李啓後表示：「雲端部署已是各產業數位轉型的關鍵，微軟持續以創新的雲端及物聯網解決方案，為夥伴生態系擴大資源，此次微軟與英業達建置 Digital Twin 平台，體現英業達智慧工廠在能源等方面的管理，以及微軟幫助企業與社會永續發展的決心，為製造業在 5G 發展的浪潮中穩步邁向數位轉型。」 # # #   關於微軟 微軟（納斯達克上市代碼︰MSFT）致力於發展intelligent cloud與intelligent edge時代的數位轉型，其使命是賦能地球上的每一個人和每一個組織，都能實現更多、成就非凡。   關於英業達 英業達成立以來，從早期製造計算機、電話機，爾後製造筆記型電腦與伺服器，奠定了公司扎實穩固的基礎，締造出傲視全球的佳績。邁入21世紀，更積極投入雲端運算，無線通訊、智能裝置、物聯網等高科技產品的領域，是臺灣前十大製造業及社會責任的標竿企業。